INTEGRATED DEVICE AND FABRICATION PROCESS THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 7, 2014
app pub date -
Feb 1, 2013
filing date -
Feb 1, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated device includes a die attach pad, a main die, a stacked die, and a mold compound. The main die has a first (e.g., bottom) surface attached to the die attach pad and has a second (e.g., top) surface. The stacked die is attached to the second surface of the main die using, for example, an adhesive film. The main die and the stacked die include silicon crystal. The mold compound encapsulates the die attach pad, the main die, and the stacked die.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully