SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Mar 15, 2013
filing date -
Feb 1, 2013
priority date (Note) -
Abandoned
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Abstract
A semiconductor package process includes the following steps, providing a first substrate having a first metal bump, the first metal bump comprises a joint portion having a first softening point; providing a second substrate having a second metal bump having a top surface, a lateral surface and a second softening point, wherein the first softening point is smaller than the second softening point; performing a heating procedure to make the joint portion of the first metal bump become a softened state; and laminating the first substrate on the second substrate to make the second metal bump embedded into the joint portion in the softened state to make the top surface and the lateral surface of the at least one second metal bump being clad extendedly by compressing the joint portion in the softened state.
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