LIGHT-EMITTING ELEMENT CHIP AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
May 25, 2011
filing date -
May 25, 2011
priority date (Note) -
Abandoned
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Abstract
There is provided a light-emitting element chip which can be safely assembled and a manufacturing method therefor. A light-emitting element chip 10 has a semiconductor layer 12 including a luminescent layer 12a on a supporting portion 11. The supporting portion 11 has a concave shape, providing a support substrate in this light-emitting element chip 10, and being connected to one electrode on the semiconductor layer 12. The outer peripheral portion of the supporting portion 11 (a supporting portion outer peripheral portion 11a) surrounds the semiconductor layer 12, and is protruded to be set at a level higher than the other face 12d and the n-side electrode 15 of the semiconductor layer 12.
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