Carbon-Metal Thermal Management Substrates
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Sep 20, 2012
filing date -
Sep 21, 2011
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Abandoned
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Abstract
A method of manufacturing a thermal management hybrid article includes electroplating a copper layer on a graphitic layer, adhering the copper-plated graphitic layer to a plate of aluminum with a nano-copper paste to form a substrate, heating the substrate in a forming gas at a temperature less than 500° C. to melt to recrystallize the nano-copper paste, and cooling the substrate after the heating. A method of manufacturing a thermal management hybrid article includes electroplating a copper layer on a graphitic layer, electroplating copper on a plate of aluminum, and soldering the copper-plated layer on the graphitic layer to the copper-plated plate of aluminum. A method of manufacturing a thermal management hybrid article also includes electroplating a copper layer on a graphitic layer and immersing the copper-plated graphitic layer in molten aluminum to cast the an aluminum layer on the copper layer.
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