CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Aug 13, 2012
filing date -
Dec 27, 2011
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Abstract
An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film is formed on a base material, and the method includes the steps of forming a film composed of copper particulates on a base material, subjecting the film to photo sintering, and applying plating to the photo-sintered film. Whereby, it is possible to form a conductive film on a base material by lowering irradiation energy of light in photo sintering even when the base material has low heat resistance. Since the conductive film includes a plated layer, electric resistance decreases.
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