COOLING ASSEMBLY
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Feb 4, 2014
filing date -
Feb 4, 2013
priority date (Note) -
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Abstract
A cooling assembly includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, a device chamber fan arrangement and a control unit. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan arrangement is configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The cooling assembly also includes a first throttle arrangement for regulating the first partial flow. The control unit is configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle arrangement.
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