CURABLE RESIN COMPOSITION CONTAINING POLYMER MICROPARTICLES
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United States of America Patent
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Issued Date -
Jul 31, 2014
app pub date -
Jan 24, 2014
filing date -
Jan 25, 2013
priority date (Note) -
Abandoned
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Abstract
A curable resin composition which contains a curable resin (A) having two or more polymerizable unsaturated bonds in a molecule, and polymer microparticles (B), and which optionally further contains an epoxy resin (C) and a low-molecular-weight compound (D) having a molecular weight less than 300 and having at least one polymerizable unsaturated bond in a molecule,
- wherein the content of component (B) is 1 to 100 parts by mass per 100 parts by mass of the sum of component (A) and component (D),the content of the epoxy resin (C) is less than 0.5 parts by mass per 100 parts by mass of the sum of component (A) and component (D),component (A) has an epoxy (meth)acrylate content less than 99 parts by mass per 100 parts by mass of the whole component (A), andcomponent (B) has been dispersed in the state of primary particles in the curable resin composition.
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