THERMOSETTING COMPOSITION, HARDENED FILM AND ELECTRONIC COMPONENT

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United States of America Patent

APP PUB NO 20140213722A1
SERIAL NO

14164261

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Abstract

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A thermosetting composition containing a compound (A) and a compound (B) is described, wherein the compound (A) is a carboxylic acid ester having at least one group represented by formula (1):

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Patent Owner(s)

Patent OwnerAddress
JNC CORPORATION2-1 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-8105

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ANRAKU, HIROSHI CHIBA, JP 2 11
HIROTA, TAKAYUKI CHIBA, JP 15 40
KIKUCHI, AYAKO CHIBA, JP 4 3
SATO, HIROYUKI CHIBA, JP 475 5314

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