Multi-Layer Pad Structure through Needle Punching Working Procedure
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United States of America Patent
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Issued Date -
Jul 31, 2014
app pub date -
Apr 19, 2013
filing date -
Jan 30, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multi-layer pad structure through needle punching working procedure is provided. The multi-layer pad structure comprises: a material layer which is a wrap knitted fabric with at least one mesh; and a base layer, which is a non-woven fabric surface composed of a needle punching cotton silk fiber, combined with the material layer tightly by embedding the needle punching cotton silk fiber into the material layer through needle punching working procedure. Accordingly, the defects of poor gluing level, high gluing cost, easy-deteriorated glue and non-environmentally protection existed in the previous multi-layer pad structure products can be improved.
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