METHOD FOR FORMING BONDED STRUCTURES AND BONDED STRUCTURES FORMED THEREBY
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United States of America Patent
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Jul 31, 2014
app pub date -
Mar 19, 2012
filing date -
Mar 18, 2011
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Abstract
A method of forming a bonded structure (10), such as for use in an automobile structure, comprises providing a first substrate (14) and a second substrate (16), and adding an adhesive region between the substrates, wherein the adhesive region has a first adhesive portion (18) and a second adhesive portion (12), and curing the first adhesive portion more quickly than the second adhesive portion, the method including positioning the substrates relative to one another and injecting the adhesive between said substrates to form an adhesive region while holding the substrates relative to one another.
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