SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140210047A1
SERIAL NO

14240453

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device including: first and second semiconductor chips mounted on a base substrate; a third semiconductor chip, which is mounted on the base substrate, and outputs control signals controlling operations of the first and second semiconductor chips; a first transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the first semiconductor chip; and a second transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the second semiconductor chip, wherein the control signals are transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip individually through the first transmission transformer and the second transmission transformer.

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Patent Owner(s)

Patent OwnerAddress
SANKEN ELECTRIC CO LTD3-6-3 KITANO NIIZA-SHI SAITAMA-KEN 352-8666

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tajima, Kazunao Niiza-shi, JP 2 4
Tanaka, Atsuhiko Niiza-shi, JP 17 374

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