PRESSURE-SENSITIVE ADHESIVE FORCE EXPRESSING UNIT, PRESSURE-SENSITIVE ADHESIVE LABEL ISSUING DEVICE, PRINTER, PRESSURE-SENSITIVE ADHESIVE FORCE EXPRESSING METHOD, AND PRESSURE-SENSITIVE ADHESIVE FORCE EXPRESSING PROGRAM

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United States of America Patent

APP PUB NO 20140209595A1
SERIAL NO

14166143

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Abstract

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A pressure-sensitive adhesive force expressing unit including: a conveyance unit for conveying a pressure-sensitive adhesive label in a predetermined direction; a thermal head including a plurality of heat generating elements arranged along a direction substantially orthogonal to the predetermined direction, the thermal head being configured to heat the pressure-sensitive adhesive label from a pressure-sensitive adhesive layer side to form a bore in a non-pressure-sensitive-adhesive function layer and expose the pressure-sensitive adhesive layer; and a control unit for energizing the plurality of heat generating elements individually to control the plurality of heat generating elements to generate heat, the control unit being configured to control the plurality of heat generating elements to generate heat by providing an intermittent energization period of intermittently energizing the plurality of heat generating elements in a heat generating period of one cycle of forming bores for one row in the non-pressure-sensitive-adhesive function layer.

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Patent Owner(s)

Patent OwnerAddress
SEIKO INSTRUMENTS INCCHIBA COUNTY CHIBA JAPAN CHIBA-SHI CHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HATAKEYAMA, Koichi Chiba-shi, JP 39 364
SATO, Yoshinori Chiba-shi, JP 280 2309
TANI, Kazuo Chiba-shi, JP 47 222

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