SINGLE RETICLE APPROACH FOR MULTIPLE PATTERNING TECHNOLOGY
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United States of America Patent
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Issued Date -
Jul 24, 2014
app pub date -
Jan 21, 2013
filing date -
Jan 21, 2013
priority date (Note) -
Abandoned
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Abstract
A reticle for multiple patterning a layer of an integrated circuit die includes a first portion with a first layout pattern for multiple patterning the layer of the integrated circuit die, and a second portion with a second layout pattern for multiple patterning the layer of the integrated circuit die. The first layout pattern is different from the second layout pattern.
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