SOUND PROCESSOR INTERCONNECTS, HEADPIECE ASSEMBLIES, AND METHODS OF MAKING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 17, 2014
app pub date -
Aug 5, 2011
filing date -
Aug 5, 2011
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An interconnect for connecting a sound processor to a headpiece and headpiece assemblies including the same. The interconnect comprises: a plug (236) including a center conductor (246), an outer conductor (242) and a crimp body (248); a coaxial cable (202) including a center conductor and an outer shield positioned over the crimp body (248); a ferrule (240) crimped to the crimp body with the outer shield there between; and a crimp pin (238) crimped to the cable center conductor and secured to the plug center conductor (246).
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully