SOLDER COMPOSITIONS

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United States of America Patent

APP PUB NO 20140199115A1
SERIAL NO

14236480

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Abstract

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A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhatkal, Ravindra M East Brunswick, US 6 82
Chattopadhyay, Kamanio Bangalore, IN 11 18
de, Avila Ribas Morgana Bangalore, IN 20 56
Lodge, Dominic Woking, GB 9 17
Nandi, Proloy Bangalore, IN 1 7
Pandher, Ranjit Plainsboro, US 40 143
Raut, Rahul Edison, US 21 50
Sarkar, Siuli Bangalore, IN 53 164
Singh, Bawa Voorhees, US 108 1502

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