Bonding Method of Resin Mold and Roll-to-Roll Continuous Mold Composition Produced by Using the Bonding Method
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United States of America Patent
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Issued Date -
Jul 17, 2014
app pub date -
Jul 31, 2012
filing date -
Aug 30, 2011
priority date (Note) -
Abandoned
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Abstract
A bonding method of a resin mold is disclosed comprising a step of butting the end parts of resin molds that is provided with a formed reversal pattern of a fine concave convex pattern that is desired to each other for bonding the resin molds, wherein a detachable resin is filled in a gap of the butted part between the end parts of the resin mold and the end parts of the resin molds are bonded to each other in an integrated manner by the hardening of the detachable resin. Also included is a roll-to-roll continuous mold composition produced thereby.
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