DIE AND METHOD OF PRODUCING DIE

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United States of America Patent

APP PUB NO 20140193537A1
SERIAL NO

14237778

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Abstract

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Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die.

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Patent Owner(s)

Patent OwnerAddress
HODEN SEIMITSU KAKO KENKYUSHO CO LTDATSUGI-SHI KANAGAWA 243-0213

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakagawa, Dai Kasugai-shi, JP 37 71

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