System and Method for Cleaning Semiconductor Fabrication Equipment Parts

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United States of America Patent

SERIAL NO

14209289

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Abstract

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An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5% wt. nitric acid and 1-10% wt. hydrogen peroxide.

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Patent Owner(s)

Patent OwnerAddress
QUANTUM GLOBAL TECHNOLOGIES LLCQUAKERTOWN PA 18951

International Classification(s)

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  • 2014 Application Filing Year
  • B44C Class
  • 260 Applications Filed
  • 239 Patents Issued To-Date
  • 91.93 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tan, Samantha Union City, US 49 3743

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Patent Citation Ranking

  • 3 Citation Count
  • B44C Class
  • 12.29 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2212021722211101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7081 - 90100 +0102030405060708090100110120130

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