Thermal Interface Materials

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United States of America Patent

APP PUB NO 20140190672A1
SERIAL NO

14210141

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to thermal interface materials comprising a filler dispersed in a polymer, wherein the filler has an average aggregate particle size of less than or equal to 1 micron. Preferably the filler is a synthetic alumina, such as fumed alumina.

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Patent Owner(s)

Patent OwnerAddress
CABOT CORPORATIONBOSTON MA 02210

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barney, Andrea O Bedford, US 4 112
Davis, Timothy D Tewksbury, US 18 576
Swaroop, Srinivas H Acton, US 15 422

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