PLASMA CHAMBER AND APPARATUS FOR TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20140190635A1
SERIAL NO

14141740

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a plasma chamber and a substrate treating apparatus. The plasma chamber includes a housing in which a gas is injected to generate plasma, a first coil disposed on one surface of the housing, and a second coil disposed on the other surface of the housing.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYSEOUL SOUTH KEREAN SEOUL
PSK INCGYEONGGI DO SOUTH KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Jeonghee Hwaseong-si, KR 16 49
CHUNG, Chin Wook Seoul, KR 7 33
HAN, Duksun Seoul, KR 1 8
KIM, Hyun Jun Busan, KR 129 703
LEE, Jong Sik Seongnam-si, KR 27 54

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