RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND HIGH-MOLECULAR WEIGHT COMPOUND
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United States of America Patent
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Issued Date -
Jul 3, 2014
app pub date -
Dec 10, 2013
filing date -
Dec 28, 2012
priority date (Note) -
Abandoned
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Abstract
A resist composition having excellent lithography properties, which generates an acid upon exposure and exhibits changed solubility in a developing solution by the action of an acid, the resist composition containing a base material component (A) which exhibits changed solubility in a developing solution by the action of an acid, and the base material component (A) containing a high-molecular weight compound (A1) having a constituent unit (a0) derived from a compound represented by the following general formula (a0-1); a method for forming a resist pattern using the resist composition; and a high-molecular weight compound (A1) having a constituent unit (a0) derived from a compound represented by the following general formula (a0-1), are disclosed.
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