LIQUID HIGH SOLIDS BINDER COMPOSITION
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United States of America Patent
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app pub date -
May 6, 2012
filing date -
May 7, 2011
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Abandoned
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Abstract
The invention described herein pertains to formaldehyde free, thermosetting liquid high solids binder compositions having rapid cure times on thermal curing and slow cure times at ambient temperatures so that the uncured binder compositions and products which comprise the uncured binder compositions have improved shelf lives.
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