SMOOTH SOLDER DEPOSITION PROCESS
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United States of America Patent
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app pub date -
Jan 3, 2013
filing date -
Jan 3, 2013
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Abstract
A method of depositing solder material onto a substrate. The method includes adjusting a pressure within a vacuum chamber, the substrate being supported within the vacuum chamber. A temperature of the substrate is reduced such that the absolute temperature of the substrate is no greater than 20% of a melting temperature of the solder material The absolute temperature is maintained while solder material is deposited onto the substrate.
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