AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES

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United States of America Patent

SERIAL NO

14140057

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Abstract

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This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO BAKELITE CO LTDTOKYO 140-0002
AKRON POLYMER SYSTEMS INC62 NORTH SUMMIT STREET AKRON OH 44308

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HARRIS, Frank W Boca Raton, US 87 2951
JING, Jiaokai Uniontown, US 34 134
OKADA, Jun Kobe-shi, JP 100 999
SUN, Limin Copley, US 45 172
UMEDA, Hideo Kobe-shi, JP 28 54
ZHANG, Dong Uniontown, US 236 2031

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