Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate
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United States of America Patent
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Issued Date -
Jun 26, 2014
app pub date -
Dec 20, 2013
filing date -
Dec 21, 2012
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Abandoned
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Abstract
A thermocompression bonding method for mounting semiconductor chips on a substrate comprises:
- picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head;positioning of the chip gripper above the assigned substrate location;lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head;heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again;waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, andlifting of the TC bonding head.
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