PLATING OF COPPER ON SEMICONDUCTORS
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United States of America Patent
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Issued Date -
Jun 26, 2014
app pub date -
Apr 19, 2012
filing date -
Apr 19, 2011
priority date (Note) -
Abandoned
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Abstract
Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
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