ELECTROLESS PLATING OF RUTHENIUM AND RUTHENIUM-PLATED PRODUCTS
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United States of America Patent
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Issued Date -
Jun 19, 2014
app pub date -
Dec 13, 2013
filing date -
Dec 14, 2012
priority date (Note) -
Abandoned
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Abstract
An electroless plating Ru bath for the deposition of Ru on the surface of a substrate comprises a Ru stock solution and hydrazine as a reducing reagent. Ru layers may be applied, for example, for use in membranes for the separation of hydrogen gas from mixtures of gases or to protect materials from corrosion. An example Ru stock solution comprises Ru chloride, hydrochloric acid, ammonia, nitrite salt, alkali hydroxide, and deionized water. The electroless plating bath may be applied to deposit ruthenium layers onto palladium layers to prepare Pd—Ru composite or alloy membranes or multilayer Pd—Ru composite or alloy membranes. Such membranes have example application to the separation of hydrogen from mixtures of gases.
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