HEAT DISSIPATION ELEMENT AND COMMUNICATION DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Jun 19, 2014
app pub date -
May 24, 2013
filing date -
Dec 17, 2012
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Abandoned
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Abstract
The present invention relates to a heat dissipation element and a communication device using the same. The heat dissipation element comprises a ceramic powder sintered layer and a thermal conductive metal layer. The ceramic powder sintered layer has a plurality of voids. Partial material of the thermal conductive metal layer is formed in the voids of the ceramic powder sintered layer.
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