ADDITIVE BUILDING
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United States of America Patent
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N/A
Issued Date -
Jun 19, 2014
app pub date -
May 31, 2012
filing date -
May 31, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An additive building method for building a plurality of layers to form a build stack is provided. The method includes creating a variable potential difference between a conducting element at a first voltage potential and an ion source at a second voltage potential, and creating an electric field between the conducting element and the ion source. The electric field passes through the build stack to a nearest surface of the build stack which is nearest a transfer medium. The method further includes accumulating electric charge from the ion source on the nearest surface of the build stack, and transferring deposition material from a transfer medium onto the nearest surface. The strength of the field at the nearest surface of the build stack is controlled in order to cause a homogenous transfer of the deposition material on to the nearest surface.
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