BONDING OF SUBSTRATES INDUCED BY IONIZING RADIATION

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United States of America Patent

SERIAL NO

14103084

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Abstract

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A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.

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Patent Owner(s)

Patent OwnerAddress
IMMUNOLIGHT LLCDETROIT MI 48226

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FATHI, Zakaryae Raleigh, US 123 1909

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