METHODS AND SYSTEMS FOR TEMPERATURE REGULATION DEVICES

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United States of America Patent

APP PUB NO 20140166075A1
SERIAL NO

14106437

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat exchanger for coupling to a device is described. The heat exchanger includes an inner layer configured for placement against at least one surface of the device, an outer layer opposite the inner layer, a fluid chamber defined between the outer layer and the inner layer, an inlet for directing a thermal transfer fluid into the fluid chamber, an outlet for receiving the thermal transfer fluid from the fluid chamber, and at least one filler within the fluid chamber. The filler is coupled to the outer layer and the inner layer and configured to control a flow of the thermal transfer fluid between the inlet and the outlet.

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Patent Owner(s)

Patent OwnerAddress
SUNEDISON INC13736 RIVERPORT DRIVE SUITE 1000 MARYLAND HEIGHTS MO 63043

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cherukupalli, Nagendra Srinivas Cupertino, US 48 178
Koppikar, Sandeep Rammohan Bangalore, IN 6 15
Prakash, Marath Bangalore, IN 8 25

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