INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD FRAME
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United States of America Patent
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Issued Date -
Jun 19, 2014
app pub date -
Dec 14, 2012
filing date -
Dec 14, 2012
priority date (Note) -
Abandoned
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Abstract
System and method of manufacturing an integrated circuit packaging system using routable grid array lead frame. Method includes providing a lead frame having top metal connector and bottom contact, and treating the top metal connector with an additive, or the bottom contact with an additive, or both. Concomitant to the treatment process, insulation cover or bottom encapsulation can be formed about the top metal connector or the bottom contact with respective openings. Upon coupling the interconnects to the lead frame the interconnects do not exceed the metal contacts by more than about 60% due to the treatment process.
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