METHOD FOR POLISHING SILICON WAFER AND POLISHING AGENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 12, 2014
app pub date -
Aug 13, 2012
filing date -
Sep 1, 2011
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The present invention is directed to a method for polishing a silicon wafer, the method comprising: polishing the silicon wafer by bringing the silicon wafer into sliding contact with a polishing pad attached to a turn table while supplying a polishing agent stored in a tank to the polishing pad; and circulating the polishing agent to recover the supplied polishing agent in the tank, wherein the silicon wafer is polished while adjusting a concentration of silicate ions contained in the polishing agent in the tank to be within a predetermined range. The present invention provides a polishing agent having a high polishing rate that enables the polishing rate to be kept constant among polishing batches, and a method for polishing a silicon wafer accurately with a target polishing stock removal or a target finishing thickness by using the polishing agent.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully