PACKAGING STRUCTURE FOR PATCHES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140158571A1
SERIAL NO

14232358

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A packaging structure (100) for a patch includes a first and second base materials (120, 130) which have a peripheral edge part laminated with each other, and the patch is included therein. The first and second base materials (120, 130) have a first to forth sides (121 to 124, 131-134). At least one of the first and second base materials (120, 130) has a first to third opening parts (125 to 127, 135 to 137). The first to third opening parts (125 to 127, 135 to 137) guides so as to open toward the inner peripheral edge (120c1, 120c2, 120c4, 130c1, 130c2, 130c4) of the sealing part (120c, 130c).

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA 567-8680
TOA EIYO LTDTOKYO 104-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akita, Yasuhiko Saitama, JP 1 2
Aoyagi, Kazuhiro Osaka, JP 13 46
Harima, Jun Osaka, JP 10 119
Iwao, Yoshihiro Osaka, JP 26 126
Konno, Masakatsu Osaka, JP 8 25
Matsui, Tadashi Fukushima, JP 13 93
Matsuoka, Kensuke Osaka, JP 44 117
Tanaka, Tomoya Osaka, JP 47 219
Toyota, Mikio Saitama, JP 1 2

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