DISTRIBUTION PLATE IN ELECTROLYTE BATH
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United States of America Patent
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Issued Date -
Jun 12, 2014
app pub date -
May 3, 2012
filing date -
Jul 7, 2011
priority date (Note) -
Abandoned
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Abstract
An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21′, 21″) with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21′, 21″) are travelling. The bath (22) comprises a collector space (24) positioned under the elongated metal elements (21, 21′, 21″) and the bath further comprises a distribution plate (26) between the collector space (24) and the elongated metal elements (21, 21′, 21″). The installation (20) further comprises a pump (25) for circulating the electrolyte in the bath (22) from the collector space (24) through the distribution plate (26). The collector space (24) causes first flow losses to the flow of the electrolyte. The distribution plate (26) has a multiplicity of openings for allowing the flow of the electrolyte and these openings cause second flow losses to the flow of the electrolyte. Each of the second flow losses is at least five times greater than the first flow losses.
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