Material for Packaging Electronic Components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

14178533

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.

First Claim

See full text

Other Claims data not available

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DESCO INDUSTRIES INC3651 WALNUT AVE CHINO CA 91710

International Classification(s)

loading....
  • 2014 Application Filing Year
  • H01B Class
  • 1335 Applications Filed
  • 1040 Patents Issued To-Date
  • 77.91 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuepper, Anton Kaarst, DE 10 227
Weinmann, Christian Alsdorf, DE 23 125

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 0 Citation Count
  • H01B Class
  • 0 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges56293522515423301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80020406080100120140160180200220240260280300320

Forward Cite Landscape

Load Citation