Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
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United States of America Patent
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Jan 26, 2016
Grant Date -
Jun 5, 2014
app pub date -
Feb 7, 2014
filing date -
Sep 20, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
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International Classification(s)
- H03K:PULSE TECHNIQUE
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- H01H:ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PR....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- H01G:CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWI....
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