MOLD ASSEMBLY

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United States of America Patent

APP PUB NO 20140154348A1
SERIAL NO

14176157

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process.

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Patent Owner(s)

Patent OwnerAddress
PIONEER MATERIAL PRECISION TECH CO LTDNEW TAIPEI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Yu-Cheng New Taipei City, TW 135 1638
Tsai, Yuan-Shun New Taipei City, TW 7 5

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