METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING
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United States of America Patent
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Issued Date -
Jun 5, 2014
app pub date -
May 31, 2012
filing date -
Jun 3, 2011
priority date (Note) -
Abandoned
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Abstract
Various embodiments provide a system for pick and transfer of semiconductor chips. The system comprises: a rotating arm; two pick up heads attached at respective end portions of the rotating arm; and a camera system for inspecting a chip pick-up position in a vertical line of sight configuration. Also, an axis of rotation of the rotating arm is offset from the line of sight. Various embodiments also provide a corresponding method.
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