PACKAGE-ON-PACKAGE STRUCTURES
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United States of America Patent
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N/A
Issued Date -
Jun 5, 2014
app pub date -
Feb 10, 2014
filing date -
Aug 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present disclosure provide a package on package arrangement comprising a first package including a substrate layer including a top side, and a bottom side that is opposite to the top side, wherein the top side of the substrate layer defines a substantially flat surface, and a first die coupled to the bottom side of the substrate layer. The arrangement also comprises a second package including a plurality of rows of solder balls and at least one of one or both of an active component or a passive component. The second package is attached, via the plurality of rows of solder balls, to the substantially flat surface of the top side of the substrate layer of the first package. The active component and/or a passive component is attached to the substantially flat surface of the top side of the substrate layer of the first package.
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