WIRING BOARD AND LASER DRILLING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jun 5, 2014
app pub date -
Mar 18, 2013
filing date -
Dec 3, 2012
priority date (Note) -
Abandoned
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Abstract
A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.
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