COMPONENT MODULE, MATING CONNECTOR, AND CONNECTION STRUCTURE BETWEEN COMPONENT MODULE AND MATING CONNECTOR

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United States of America Patent

APP PUB NO 20140148019A1
SERIAL NO

14087240

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The invention provides a component module including a case, a circuit board, an electronic component, and a connector. The case has a through-hole. The circuit board is provided in the case. The electronic component and the connector are mounted on the circuit board. The connector includes a connecting portion and a terminal. The connecting portion is opposed to or located inside the through-hole of the case. At least a portion of the terminal is located at the connecting portion.

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Patent Owner(s)

Patent OwnerAddress
HOSIDEN CORPORATION4-33 KITAKYUHOJI 1-CHOME YAO-SHI OSAKA 581-0071

International Classification(s)

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  • 2013 Application Filing Year
  • H01R Class
  • 2765 Applications Filed
  • 2646 Patents Issued To-Date
  • 95.70 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAGATA, Takayuki Yao-shi, JP 150 2217
SASAKI, Daisuke Yao-shi, JP 204 857

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Patent Citation Ranking

  • 7 Citation Count
  • H01R Class
  • 7.51 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2061764443155653327161375801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +01002003004005006007008009001000110012001300140015001600170018001900

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