SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
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United States of America Patent
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Issued Date -
May 29, 2014
app pub date -
May 10, 2013
filing date -
Nov 28, 2012
priority date (Note) -
Abandoned
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Abstract
An electronic substrate includes a non-conductive body and one or more conductive features coupled to the non-conductive body. Each of the conductive features includes a base layer. To preserve the performance and conductivity of the one or more conductive features, each of the conductive features includes a protective layer formed over the base layer. The protective layer may include a first layer of silver formed over the base layer and a second layer of palladium formed over the first layer. By depositing the protective layer over the base layer of each of the conductive features, oxidation and exposure of the conductive features is prevented, or at least substantially reduced, since the first layer and the second layer provide a migration barrier for the metal in the base layer. However, the performance and conductivity of the conductive features are maintained due to the low resistivity of silver and palladium.
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