Apparatuses and methods for fabricating semiconductor packages
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United States of America Patent
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May 12, 2015
Grant Date -
May 29, 2014
app pub date -
Jan 31, 2014
filing date -
Oct 28, 2009
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Abstract
An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.
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