Methods For The Recycling of Wire-Saw Cutting Fluid
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United States of America Patent
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Issued Date -
May 29, 2014
app pub date -
Nov 26, 2012
filing date -
Nov 26, 2012
priority date (Note) -
Abandoned
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Abstract
A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.
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