SURFACE FINISH FOR CONDUCTIVE FEATURES ON SUBSTRATES
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United States of America Patent
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Issued Date -
May 29, 2014
app pub date -
May 10, 2013
filing date -
Nov 28, 2012
priority date (Note) -
Abandoned
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Abstract
An electronic substrate includes one or more conductive features. In order to preserve the performance and conductivity of the one or more conductive features, the exposed portions of the conductive features are deposited with a protective layer comprising a layer of silver, followed by a layer of gold. By covering the exposed portions of the conductive features of the electronic substrate with the protective layer, oxidation and exposure of the conductive features is prevented, thereby preserving the performance and conductivity of the copper features. Further, during a soldering process, the protective layer is substantially dissolved, thereby allowing the solder to join directly with the underlying conductive features and improving the performance of the electronic substrate.
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