EVAPORATOR FOR LOOPED HEAT PIPE SYSTEM AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
May 29, 2014
app pub date -
Feb 15, 2013
filing date -
Nov 26, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool a heat generating electronic component that generates heat during operation, the evaporator including: a body including an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a copper powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a surface of the sintered wick, wherein the additional layer is formed by sintering copper particles having a size smaller than that of the copper powder forming the sintered wick, and the working fluid moved from the sintered wick is changed in a vapor state to be discharged.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ZALMAN TECH CO LTD | 448 GASAN-DONG GUMCHUN-GU 1007 DAERYUNG TECHNO TOWN III SEOUL |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CHOI, Jee Hoon | Seoul, KR | 4 | 16 |
HA, Min Seok | Gyeongsangbuk-do, KR | 1 | 1 |
LEE, Yun Keun | Seoul, KR | 33 | 322 |
SEO, Min Whan | Gyeonggi-do, KR | 11 | 66 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 29, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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