PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFER
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United States of America Patent
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Issued Date -
May 22, 2014
app pub date -
Nov 19, 2013
filing date -
Nov 20, 2012
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Abandoned
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Abstract
A process for polishing a semiconductor wafer includes simultaneous polishing of a front side and of a reverse side of a substrate wafer in the presence of polishing medium so as to achieve material removal from the front side and the reverse side of the substrate wafer. The simultaneous polishing includes a first step and a second step. A speed of material removal in the first step is higher than in the second step. The first step includes the use of a first polishing slurry as a polishing medium and the second step includes a second polishing slurry as the polishing medium. The second polishing slurry differs from the first polishing slurry at least in that the second polishing slurry comprises a polymeric additive.
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