PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 22, 2014
app pub date -
Nov 18, 2013
filing date -
Nov 20, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package structure and a manufacturing method thereof are disclosed. The package structure includes an outer lead, a driver chip, a soft material, and a solidified material. There is a distance between the driver chip and the outer lead. The soft material is used to fill the space in the package structure except the driver chip and the outer lead. The solidified material is formed in at least one region on the soft material between the driver chip and the outer lead. The hardness of the solidified material is higher than the hardness of the soft material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully