METHOD FOR PROCESSING A DIE
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United States of America Patent
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Issued Date -
May 15, 2014
app pub date -
Nov 12, 2012
filing date -
Nov 12, 2012
priority date (Note) -
Abandoned
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Abstract
In various embodiments, a method for processing a die is provided. The method may include forming a periodic structure at least one of over and in a carrier, the periodic structure including a plurality of structure elements; depositing masking material over the periodic structure; partially removing masking material to expose at least one structure element but not all of the structure elements; and removing the exposed at least one structure element.
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